A. K Info

Additional Information:

• Production Capacity: 10CC
• Delivery Time: 4-5 WORKING DAYS

Smooth glue even force

* Suitable for large-capacity

* Suitable for 30ml syringe oil,

* Solder paste, UV solder mask oil, structural adhesive, etc.

* Comfortable to hold and even force

* Ergonomic design.

The main raw material is collected from the red pine in the Northeast of Heilongjiang

Great soldering work tool for smartphone, PCB, BGA, and electronic parts repair.

Mild pH, no corrosiveness to IC or PCB.

Transparent residue, no washing needed.

The melting point is slightly higher than the soldering tin.

The MECHANIC XG-50 35G 183° PPD paste is a soldering product with a 35g content, designed for high-precision soldering applications with a melting point of 183°C

• 100% brand new and high quality 
• Unique recipes, excellent performance, easy to weld, solder bright and full, no welding, false welding and so on 
• Good soldering and welding tool 
• Professional in cream for BGA mechanical lead-free welding flux paste for BGA soldering station.
• Soldering paste, 183 °C, melting point grade, easy welding, easy molding.
  
  MECHANIC ZC50 50G 158° PPD PASTE

   

  This series of solder paste is customized for high-precision maintenance, and the solder paste has moderate humidity, is not easy to agglomerate, easy to tin, and no virtual soldering

   

  The new formula with storability, Excellent antioxidants, the quality over another supplier too much

   

  Features:

   

  1. This series of solder paste is customized and developed for high-precision maintenance. The solder paste has moderate humidity, is not easy to agglomerate, easy to tin, and has no false soldering.

  2. The new formula is durable to storage, and its anti-oxidation performance is at least 2 times higher than that of similar solder pastes. The high-quality solder paste is even and delicate.

  3. No False Soldering / Less Residue / Bright Solder Joints / Strong Tin Climbing / Good Conductivity / Oxidation Resistance / Non-Corrosion PCB / No-Cleaning
  
  

  MECHANIC DW50 50G 138° PPD PASTE

   

  • This series of solder paste is customized and developed for high-precision maintenance. The solder paste has moderate humidity, is not easy to agglomerate, easy to tin, and has no false soldering.

  • Brand and Model: "MECHANIC DW50" is the brand and model name of the solder paste.

  • Quantity: The product contains 50 grams (50g) of solder paste, which is a common quantity for soldering applications.

  • 138°C Melting Point: The "138°C" refers to the reflow temperature or the temperature at which the solder paste melts and reflows during the soldering process. This temperature is crucial for proper bonding without damaging sensitive components.

  • PPD Composition: The "PPD" designation might refer to the type or composition of the solder paste, which could include various elements like flux, solder alloy particles, and other additives needed for the soldering process.

MECHANIC XZ10 0.20mm solder ball Have Lead Welding Tin Bead Motherboard Chip Hard Disk Baseband Repair Soldering Tin Ball Repair Tools The BGA solder ball has the following characteristics:

• MECHANIC solder ball 10000PCS/Bottle
• Composition: Sn63/Pb37 ( 63% tin /  37% lead )
• Meet EU ROHS and REACH standards.
• With high reliability, excellent mechanical properties, good thermal fatigue resistance and oxidation resistance.
• Purity and sphericity are very high, with no surface defects.
• Suitable for BGA, CSP, and other cutting-edge packaging technology and the use of micro-welding.
• The minimum diameter of the solder ball is 0.20mm, non-standard sizes can be customized according to customer requirements.
• When using the automatic calibration with the ability and allow the placement of a relatively large error, unprovoked surface flatness problems.
  
  
  MECHANIC XZ10 0.25mm SOLDER BALL 10000 PCS

   

  MECHANIC XZ10 0.25mm solder ball Have Lead Welding Tin Bead Motherboard Chip Hard Disk Baseband Repair Soldering Tin Ball Repair Tools The BGA solder ball has the following characteristics:
  
  
  
  • MECHANIC solder ball 10000PCS/Bottle
  • Composition: Sn63/Pb37 ( 63% tin /  37% lead )
  • Meet EU ROHS and REACH standards.
  • With high reliability, excellent mechanical properties, good thermal fatigue resistance, and oxidation resistance.
  • Purity and sphericity are very high, with no surface defects.
  • Suitable for BGA, CSP, and other cutting-edge packaging technology and the use of micro-welding.
  • The minimum diameter of the solder ball is 0.20mm, non-standard sizes can be customized according to customer requirements.
  • When using the automatic calibration with the ability and allow the placement of a relatively large error, unprovoked surface flatness problems.
    
    
    MECHANIC XZ10 0.30mm SOLDER BALL 10000 PCS

     

    MECHANIC XZ10 0.30mm solder ball Have Lead Welding Tin Bead Motherboard Chip Hard Disk Baseband Repair Soldering Tin Ball Repair ToolsThe BGA solder ball has the following characteristics:

    • MECHANIC solder ball 10000PCS/Bottle
    • Composition: Sn63/Pb37 ( 63% tin /  37% lead )
    • Meet EU ROHS and REACH standards.
    • With high reliability, excellent mechanical properties, good thermal fatigue resistance and oxidation resistance.
    • Purity and sphericity are very high, with no surface defects.
    • Suitable for BGA, CSP, and other cutting-edge packaging technology and the use of micro-welding.
    • The minimum diameter of the solder ball is 0.20mm, non-standard sizes can be customized according to customer requirements.
    • When using the automatic calibration with the ability and allow the placement of a relatively large error, unprovoked surface flatness problems.

Additional Information:

• Item Code: XZ10
• Packaging Details: 10000PCS

• Imported rosin ,no virtual welding, easy to tin.
• The color is pure, no impurities.
• Running tin is fast and has less smoke.
• High insulation resistance, suitable for mobile phone PCB,CPU repair.

AKT PF-50 FlUX PASTE.

PCB-BGA-PGA-SMD PASTE FLUX

High Joint Intensity good immersion .No Poison No corrosion .Good Insulation ,Smooth Welding Surface No Deterioration No Dry High Quality, 100% original &  tested before shipping. 

Additional Information:

• Item Code: AKTPF-50
• Production Capacity: 100
• Delivery Time: 7 TO 10 Days
• Packaging Details: BOX TYPE Bubble Wrap

Additional Information:

• Delivery Time: 4-5 WORKING DAYS

Additional Information:

• Delivery Time: 4-5 WORKING DAYS

• Flex paste and liquid are used to remove oxidation (= ease of tinning of parts) from the printed circuit fiber and the base of the parts.
• Flex paste is a regenerating tin liquid that gives it a spherical or convex shape due to contact with tin.
• The problem is cleaner work and better connections.
• At the same time, it reasonably prevents the connection between the bases during assembly and removal, which with this property helps a lot to prevent the tin from spreading around the work (which causes the bases to be eaten together or the bases to be connected).
• Flex paste also causes good heat dissipation, which increases the heat tolerance of the parts and prevents them from burning.

Additional Information:

• Delivery Time: 4-5 working days

1. Solve the problem of repeated game restarts caused by high CPU temperature.

2. Does not freeze at low temperatures and does not freeze in high-temperature environments

3. Good heat conduction, good heat dissipation, and fast cooling.

4. Multi-scenario applications can be used for CPU, GPU, microcontroller development boards, etc.