A. K Info

1. BGA stencil
2. SMT stencil
3. PCB assembly stencil
4. Stencil design
5. Stencil fabrication
6. Stencil thickness
7. Stencil material
8. Stencil aperture
9. Solder paste stencil
10. BGA rework stencil
11. Stencil alignment
12. Stencil cleaning
13. Stencil printer
14. Stencil inspection
15. Stencil frame

Features:

• Middle layer tin planting platform set for iPhone X/XS/XS Max/11/ 11 Pro/11Pro 

• Super magnetic force / Multi-model infinite extension base / Precise positioning and close fit

• Precise positioning / Fast tin planting / Strong magnetic adsorption

• Built-in three high-temperature strong magnets, strong magnetic adsorption, precise positioning, no offset, high-temperature magnetism

• High-quality steel, round and square precise hole positions make the solder balls more rounded and prevent the mesh from jamming the solder balls

• Anti-drum, so that each solder ball is round and full, to meet the needs of various chips

• With precise positioning, it is more convenient to align the whole position

• Silicone material is used to effectively isolate temperature and prevent scalding

• The real machine is measured to ensure accuracy, and each detail, hole position, and mesh is proofread according to the original drawings to ensure that every solder joint cannot be missing.
  
  
  JTX ZX-01 Silicone Middle Layer Bga Reballing Platform Set for Iphone 12 Series

   

  Features:

  • Middle layer tin planting platform set for iPhone  Max/12/12 Mini/12 Pro/12Pro Max
  • Super magnetic force / Multi-model infinite extension base / Precise positioning and close fit
  • Precise positioning / Fast tin planting / Strong magnetic adsorption
  • Built-in three high-temperature strong magnets, strong magnetic adsorption, precise positioning, no offset, high-temperature magnetism
  • High-quality steel, round and square precise hole positions make the solder balls more rounded and prevent the mesh from jamming the solder balls
  • Anti-drum, so that each solder ball is round and full, to meet the needs of various chips
  • With precise positioning, it is more convenient to align the whole position
  • Silicone material is used to effectively isolate temperature and prevent scalding
  • The real machine is measured to ensure accuracy, and each detail, hole position, and mesh is proofread according to the original drawings to ensure that every solder joint cannot be missing.
    
    
    JTX ZX-01 SILICONE MIDDLE LAYER BGA REBALLING PLATFORM SET FOR IPHONE 13 SERIES

    Features:

    • Middle layer tin planting platform set for iPhone  Max/13/13 Mini/13 Pro/13Pro Max
    • Super magnetic force / Multi-model infinite extension base / Precise positioning and close fit
    • Precise positioning / Fast tin planting / Strong magnetic adsorption
    • Built-in three high-temperature strong magnets, strong magnetic adsorption, precise positioning, no offset, high-temperature magnetism
    • High-quality steel, round and square precise hole positions make the solder balls more rounded and prevent the mesh from jamming the solder balls
    • Anti-drum, so that each solder ball is round and full, to meet the needs of various chips
    • With precise positioning, it is more convenient to align the whole position
    • Silicone material is used to effectively isolate temperature and prevent scalding.

Additional Information:

• Item Code: ZX01

Stencil Purpose: Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.

Reballing: Stencils are also commonly used in reballing processes, which involve removing and then re-soldering a component, such as a BGA (Ball Grid Array) chip. The stencil helps apply solder balls to the component's pads with precision.

Compatible Devices: The stencil is likely designed for use with specific models. Each stencil is typically designed to match the component layout of a particular device or series.

Aperture Design: The stencil features a pattern of tiny apertures (holes) that align with the solder pads on the PCB or component. When solder paste is applied over the stencil and pushed through these apertures, it deposits a controlled amount of solder onto the pads.

Stencil Material: Stencils are commonly made from stainless steel or other durable materials to withstand repeated use and exposure to high-temperature soldering processes.

Stencil Purpose: Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.

Reballing: Stencils are also commonly used in reballing processes, which involve removing and then re-soldering a component, such as a BGA (Ball Grid Array) chip. The stencil helps apply solder balls to the component's pads with precision.

Compatible Devices: The stencil is likely designed for use with specific models. Each stencil is typically designed to match the component layout of a particular device or series.

Aperture Design: The stencil features a pattern of tiny apertures (holes) that align with the solder pads on the PCB or component. When solder paste is applied over the stencil and pushed through these apertures, it deposits a controlled amount of solder onto the pads.

Stencil Material: Stencils are commonly made from stainless steel or other durable materials to withstand repeated use and exposure to high-temperature soldering processes.